Intel Announce High Density, High Performance SS7 cPCI Board now available

The SS7HDC Compact PCI board offers SS7 performance and density for signaling, call control, wireless messaging, and intelligent network applications. Options to support up to 32, 64 or 128 SS7 links on a single board enables high-density systems to be designed with these boards, whilst message signaling unit (MSU) throughput ensures high performance for the most demanding non-circuit related applications.

The SS7HDC board is PICMG 2.16 compatible, which ensures compatibility with the most advanced current Compact PCI chassis that offer Ethernet on backplane capability. The SS7HDC datasheet is now accessible via the Intel website at the following links:

Product Datasheet

http://www.icg-corp.com/new/pdf/SS7HDC.pdf

Product Highlight

System size	Public network / Large enterprise
Form factor	CompactPCI, PICMG 2.16 Compatible
Resource bus	H.110 CT Bus
SS7 links	Up to 128 SS7 signaling links
Operating systems	Red Hat* Linux* 7.2, 7.3, 8.0, 9.0 and Red Hat Enterprise Linux AS 3 (kernel 2.4.21-4.0.1 Windows* 2003 Windows XP* Windows 2000
Network interface	Up to 16 T-1 or E-1 (software selectable) digital interfaces
Signaling	Large choice of SS7 protocols: MTP, ISUP, TUP, SCCP, TCAP, MAP, IS41, INAP, running on-board or on the host computer
Key features	Hot swap PICMG* 2.16 compatible Capable of high message rates on all SS7 links SS7 link sets can be distributed over multiple boards which enhances system reliability and removes single points of failure Multiple onboard Intel® processors based on Intel XScale® technology supports up to 128 SS7 links Compatible with existing SS7 protocol stack products from Intel (MTP, ISUP, TUP, SCCP, TCAP, MAP, IS41, INAP) and software selectable T-1 or E-1 digital network interfaces
Applications	Wireless messaging Advanced intelligent networking/Intelligent networking Service control points (SCPs) Location-based services Call control/Call routing

For details: sales@icg-corp.com

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